Yamaichi Electronics has introduced new test contactors within its YED254 and YED274 series for testing ultra-fine pitch semiconductor devices.
New semiconductor devices such as wafer level CSPs for mobile applications have ball pitches of 0.35mm. The TCs can be custom designed for different dimensions. A homogenous force distribution on the device surface is important to avoid device cracking. It is designed with compression mount technology, therefore no soldering is needed.
November 3, 2015
John joined UKi Media & Events in 2012 and has worked across a range of B2B titles within the company's automotive, marine and entertainment divisions. Currently editor of Automotive Testing Technology International, Crash Test Technology International and Electric & Hybrid Marine Technology International, John co-ordinates the day-the-day operations of each magazine, from commissioning and writing to editing and signing-off, as well managing web content. Aside from the magazines, John also serves as co-chairman of the annual Electric & Hybrid Marine Awards and can be found sniffing out stories throughout the halls of several of UKI's industry-leading expo events.
