Engineers across disciplines will realize step-change improvements in the way they develop products using the newly released ANSYS 17.0. The most feature-rich release in the company’s history, it delivers tenfold improvements to product development productivity, insight and performance.
Through tighter integration of semiconductor and electronics simulation solutions, ANSYS 17.0 delivers a comprehensive chip-package-system design workflow. New capabilities for automated thermal analysis and integrated structural analysis deliver an unequalled chip-aware and system-aware simulation solution, enabling customers to deliver smaller, higher-power density devices to market faster.
In the fluids suite, ANSYS has implemented breakthrough advancements in physics modeling and introduced new innovations across the entire workflow and user environment design to accelerate time to results by up to 85% without compromising accuracy. Improvements to workflow and meshing enable novice users to quickly become productive while new tools and options expand the application reach for experienced users.
February 3, 2016