ANSYS solutions enabled on Samsung’s latest FinFET technology

0

Samsung has certified ANSYS solutions of self-heat for 10nm chip technologies and enablement of electromigration (EM) and voltage drop (IR) for the latest 7LPP/8LPP technologies.

For those applications where reliability over time is an absolute requirement, ANSYS solutions perform a variety of analyses of the Systems on Chips (SoCs), including extraction, power and reliability, signal and power integrity, and thermal reliability over the chip’s expected life. ANSYS and Samsung collaborated on this certification and enablement process to provide customers with the most reliable solutions to develop innovative, reliable products faster while minimizing design costs and risk.

“Self-heat and thermal analyses are absolute requirements for automotive and high-performance computing applications. We collaborated with ANSYS to enable their solutions for Samsung Foundry’s leading-edge process platforms, empowering customers to create the most robust and reliable SoCs,” said Suk Won Kim, VP of the design technology team at Samsung Electronics.

May 31, 2017

Share.

About Author

mm

John joined UKi Media & Events in 2012 and has worked across a range of B2B titles within the company's automotive, marine and entertainment divisions. Currently editor of Automotive Testing Technology International, Crash Test Technology International and Electric & Hybrid Marine Technology International, John co-ordinates the day-the-day operations of each magazine, from commissioning and writing to editing and signing-off, as well managing web content. Aside from the magazines, John also serves as co-chairman of the annual Electric & Hybrid Marine Awards and can be found sniffing out stories throughout the halls of several of UKI's industry-leading expo events.

Comments are closed.